Ikilasi Finayiloni/i-polyester eguquliwe eyindilinga enameleducingo lwethusi
Incazelo Yomkhiqizo
Lezi zintambo eziqinile zokumelana zisetshenziswe kabanzi kuma-resistors ajwayelekile, imoto
izingxenye, resistors emazombezombe, njll usebenzisaukwahlukanisaukucutshungulwa okufaneleka kakhulu kulezi zinhlelo zokusebenza, ukusebenzisa ngokugcwele izici ezihlukile zokumbozwa koqweqwe lwawo.
Ngaphezu kwalokho, sizokwenza ukunamathela koqweqwe lwawoukwahlukanisayocingo lwensimbi oluyigugu njengesiliva neplatinamu uma i-oda. Sicela usebenzise lokhu kukhiqiza-on-oda.
Uhlobo lwentambo ye-alloy engenalutho
Ingxubevange esingayenza enamelled iCopper-nickel alloy wire,Constantan wire,Manganin wire. I-Kama Wire, i-NiCr Alloy wire, i-FeCrAl Alloy wire njll i-alloy wire
Uhlobo lwe-insulation
Igama le-insulation-enamelled | Izinga le-ThermalºC (isikhathi sokusebenza 2000h) | Igama lekhodi | Ikhodi ye-GB | I-ANSI. UHLOBO |
I-polyurethane enamelled wire | 130 | UEW | QA | MW75C |
I-polyester enamelled wire | 155 | I-PEW | QZ | MW5C |
Intambo enamelled ye-polyester-imide | 180 | I-EIW | QZY | MW30C |
I-Polyester-imide ne-polyamide-imide ehlanganiswe kabili ngocingo olunameleli | 200 | EIWH (DFWF) | QZY/XY | MW35C |
Intambo enamelled ye-Polyamide-imide | 220 | I-AIW | QXY | MW81C |
Okuqukethwe Kwekhemikhali, %
Cu | Bi | Sb | As | Fe | Ni | Pb | S | Zn | I-ROHS Directive | |||
Cd | Pb | Hg | Cr | |||||||||
99.90 | 0.001 | 0.002 | 0.002 | 0.005 | - | 0.005 | 0.005 | - | ND | ND | ND | ND |
Izakhiwo Zomzimba
I-Melting Point - i-Liquidus | 1083ºC |
I-Melting Point - i-Solidus | 1065ºC |
Ukuminyana | 8.91 gm/cm3@ 20 ºC |
I-Gravity ethize | 8.91 |
Ukungazweli Kagesi | 1.71 microhm-cm @ 20 ºC |
Ukuqhutshwa kukagesi** | 0.591 MegaSiemens/cm @ 20 ºC |
I-Thermal Conductivity | 391.1 W/m ·oK ngo-20 C |
I-Coefficient of Thermal Expansion | 16.9 ·10-6perºC(20-100 ºC) |
I-Coefficient of Thermal Expansion | 17.3 ·10-6perºC(20-200 ºC) |
I-Coefficient of Thermal Expansion | 17.6·10-6perºC(20-300 ºC) |
Amandla Okushisa athize | 393.5 J/kg ·oK ngo-293 K |
I-Modulus of Elasticity in Tension | 117000 MPA |
I-Modulus of Rigidity | 44130 Mpa |
Ukusetshenziswa kwe-Copper foil
1) Ama-electricsprings, amaswishi
2) Amafreyimu okuhola
3) Izixhumi nemihlanga ye-oscillation
3) Inkundla ye-PCB
4) Ikhebula lokuxhumana, i-Cable armoring, i-Mainboard yeselula
5) Ukukhiqizwa kwebhethri ye-ion ngefilimu ye-PI
6) Izinto zokuqoqa i-PCB(i-electrode backing).